Expert in microscale two-phase flow and heat transfer and modeling of micro-evaporators
John Thome
3D Stacked Architectures with Interlayer Cooling

Expert in thermal modeling of multiprocessor architectures and thermal management, hardware/software co-design methods
David Atienza
Expert in chip design, intelligent detector, VLSI design, high-level specification and synthesis, sensors development
Yusuf Leblebici

Expert in thermal packaging of high performance computers
Bruno Michel
Expert in micro-scale liquid phase cooling, nanofluid heat transfer and heat transfer modeling
Dimos Poulikakos
Expert in catalyst nanoparticles, nanomaterials and conception and characterization of nanofluids
Jan Wendelin Stark

Project Description

The project addresses interlayer cooling of 3D computer  chips, including water cooling, two-phase refrigerant cooling, development and perfection  of new micro-fabrication techniques  for TSVs and their connections, bonding  of stacked layers together, dynamic thermal modeling of 3D chips, and extensive experimental testing of2D and 3D cooling solutions and new thermal models. 

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Read the Project Presentation

Our researchers in the media

Notable publications

Soft iron/silicon composite tubes for magnetic peristaltic pumping: Frequency-dependent pressure and volume flow
R. Fuhrer, C.M.Schumacher, M. Zeltner, and Wendelin J. Stark
Advanced Functional Materials

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks
A. Vincenzi, A. Sridhar, M. Ruggiero and D. Atienza Alonso
22nd edition of Great lakes symposium on VLSI (GLSVLSI2012)

Development and characterization of custom-engineered and compacted nanoparticles as calibration materials for quantification using LA-ICP-MS
Daniel Tabersky, Norman A. Luechinger, Michael Rossier, Eric Reusser, Kathrin Hametner, Beat Aeschlimann, Daniel A. Frick, Samuel C. Halim, Jay Thompson, Leonid Danyushevskyd and Detlef Günther
Journal of Analytical Atomic Spectrometry

Synthesis of Trisubstituted Ureas by a Multistep Sequence Utilizing Recyclable Magnetic Reagents and Scavengers
Quirin M. Kainz, Martin Zeltner, Michael Rossier, Wendelin J. Stark, and Oliver Reiser
Chemistry : a European journal


Posters from 2013

3D ALE Finite Element Method for Two-Phase Flows with Phase Change
Gustavo Anjos, Navid Borhani, John R. Thome

EDA for CMOSAIC: a new generation of CAD tools for liquid-cooled 2D/3D ICs
Arvind Sridhar, Mohamed Sabry, Alessandro Vincenzi, David Atienza, Thomas Brunschwiler

Superhydrophobic surfaces
Michael Rossier, Daniela Paunescu, Wendelin Jan Stark

Integrated Water Cooling of 3D Electronic Chips
Adrian Renfer, Fabio Alfieri, Manish K. Tiwari, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos

Posters from 2012

Posters from 2011

3D ALE-FEM for Microscale Two-Phase Flows
Gustavo Anjos, Navid Borhani, John Thome

Two-Phase Integrated Cooling of a Single Layer of a 3D Stacked Chip
Sylwia Szczukiewicz, Navid Borhani, John Thome

Two-phase interlayer heat removal of processor stacks: a practical implementation
Yassir Madhour, Thomas Brunschwiler, Bruno Michel, John Thome

Fabrication of Test Chips for Two-phase Cooling Experiment
Yuksel Temiz, Yusuf Leblebici, Sylvia Szczukiewicz, Navid Borhani, John Thome, Thomas Brunschwiler


Project Photos