Associated Posters
| 3D ALE-FEM for Microscale Two-Phase Flows | Gustavo Anjos, Navid Borhani, John Thome |
| Two-Phase Integrated Cooling of a Single Layer of a 3D Stacked Chip | Sylwia Szczukiewicz, Navid Borhani, John Thome |
| Two-phase interlayer heat removal of processor stacks: a practical implementation | Yassir Madhour, Thomas Brunschwiler, Bruno Michel, John Thome |
| Fabrication of Test Chips for Two-phase Cooling Experiment | Yuksel Temiz, Yusuf Leblebici, Sylvia Szczukiewicz, Navid Borhani, John Thome, Thomas Brunschwiler |
| 3D-ICE: a new thermal simulator for 3D ICs with interlayer liquid cooling | Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, David Atienza |
| Thermal Analysis and Active Cooling Management for 3D MPSoCs | Mohamed Sabry, Ayse K. Coskun, David Atienza |
| Wafer level TSV compatible to liquid cooling high performance CMOS | Michael Zervas, Yuksel Temiz, Yusuf Leblebici |
| Die-Level Through-Silicon-Via (TSV) Fabrication Platform | Yuksel Temiz, Michael Zervas, Carlotta Guiducci, Yusuf Leblebici |
| Integrated Single Phase Water Cooling of 3D Chips: Modeling and Experiments | Adrian Renfer, Fabio Alfieri, Manish Tiwari, Igor Zinovik, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos |
| Superhydrophobic surfaces | Michael Rossier, Jan Wendelin Stark |
